MagnaChip Semiconductor is a leading designer, developer and manufacturer of mixed-signal and digital multimedia semiconductors addressing the convergence of consumer electronics and communications devices. We focus on CMOS image sensors and flat panel display drivers, which are complex, high performance, mixed signal semiconductors that capture images and enable and enhance the features and capabilities of both small and large flat panel displays. MagnaChip also provides wafer foundry services utilizing CMOS high voltage, embedded memory, analog and power process technologies for the manufacture of IC's for customer-owned designs. MagnaChip has world-class manufacturing capabilities and an extensive portfolio of approximately 8,500 registered and pending patents. As a result, MagnaChip is a valued partner in providing leading technology solutions to its customers worldwide.
Notice: Only English resume and application will be considered for this post.
Responsibilities:
1.Process and Quality management for backend process of power device; 2.New supplier survey and setting-up for supplier of power device device package; 3.New product package development of Power device; 4.Reforming and leading various technical issues. 5.supplier management and leadership skills
Requirements:
1.With university graduates or equivalent; 2.Advanced package technology of power device packaging is required; 3.Knowledge of office processes, procedures and management skill to control supplier. 4.Good attitude and team work spirit , Self-supporting. 5.Able to work under pressure
